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Year 2004
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- Initial Capital Raised and Company Registered for M-MOS Semiconductor Sdn. Bhd.
- Design and Prototype Started on 200mm Technology with 0.2um trench
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Year 2005
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- Proven 500 Mcell/in² technology for low Voltage (<50V) N and P Channels
- 1st Product Launching in 2Q05
- Mass production started in 4Q05
- Total 7 products launched in 2005
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Year 2006
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- ISO9001 :2000 Audit and Certification
- Development of 500M Cell/in² low voltage (40V – 75V) Trench MOSFET
- Monolithically integrated MOSFET with ESD
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Year 2007
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- Production ramp up to >6Kwafers/month
- Total 58 products launched to date
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Year 2008
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- Company Registration for M-MOS Semiconductor Hong Kong Ltd. as headquarters and subsidiary of Xtrion N.V.
- 22 new products introduced in 2008
- Officially setup M-MOS Semiconductor Sdn. Bhd. as subsidiary of M-MOS Semiconductor Hong Kong Ltd.
- Setup M-MOS Semiconductor Hong Kong Ltd., Taiwan Branch.
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Year 2009
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- ISO9001 :2008 Audit and Certification
- Started development of automotive quality MOSFET and 600V IGBT, target to be released in 2010
- 11 new products introduced in 2009
- Release next generation products with improved specific Rdson and further die size shrink
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